105 lines
2.8 KiB
Markdown
105 lines
2.8 KiB
Markdown
# TSYS Group Handbook - Engineering Documentation - Team HwEng - Tooling
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## Introduction
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This article covers the support stack of software and hardware used by the hardware engineering
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team to develop the orbiter.
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Topics covered by this documentation:
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* Computer Systems
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* Dev/qa/prod systems
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* (Custom) Hardware machines/tools for prototypes
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* Envelope Sealer
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* Inflator
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* Pressure chamber
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* Reflow Oven
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* RF Testing chamber
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* Environmental Testing - Temperature
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* Environmental Testing - UV
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* Software
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See the following links for the software setup guides
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- <https://git.turnsys.com/TSGTechops/docs-techops/src/branch/master/TSYS-DevEnv-VsCode.md>
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- <https://git.turnsys.com/mrcharles/dotfiles/src/branch/master/README.md>
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## Computer Systems
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* Raspberry Pi
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* subobench (all lab equipment with a digital interface is attached to this). Documented on discourse.
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* x86 servers
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* subodev We develop workloads here. Once a day update or so. (After any needed iterations on our dev workstations)
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* suboqa We run qa/unit/integration/burn in etc tests here on all workloads. Expect once a week updates or so.
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* suboprod We run production workloads here. All things on here should be expected to come under regulatory review. May be considered a system of record, need to ponder. This is CUDA enabled (quadro). Expected to be under cluster control (slurm).
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* Tegra cluster
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* suboprod01-05
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## (custom) tooling for prototypes
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### Envelope Heat Sealer
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* Overview
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This is used for assembling the envelopes. It's a customized heat sealer, controlled by an Arduino for precision temperature control.
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* Bill of Materials
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### Inflator
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* Overview
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This is used for inflating the envelopes once they've been assembled (in particular for leak detection).
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It's a customized pump , controlled by an Arduino for precision pressure control.
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* Bill of Materials
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### Pressure chamber
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* Overview
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* Bill of Materials
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### Reflow Oven
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* Overview
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This is used
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* Bill of Materials
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### Cameo Silhouette
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* Overview
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This is used to (primarily) make solder stencils for PCB re-work we will be doing on prototypes.
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### RF Testing Chamber
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We will do as much EMC testing in house as we can. This will save us 10s of thousands of dollars
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and will increase our first pass chances at the FCC certified lab immensely. We can also rent out the chamber when we aren't using it.
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* Major components
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* Considerations/concerns
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* Budget/BoM
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### Environmental Testing
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We will do as much environmental testing in house as we can. Need to research if any external testing is required by regulation, but currently (03/03/2021) I'm un-aware of any that is required.
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Of course we will test extensively , for robustness etc.
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* Major components
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* Considerations/concerns
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* Budget/BoM
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#### UV
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#### Extreme cold
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