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team-hweng/HwEngTooling.md

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+# TSYS Group Handbook - Engineering Documentation - Team HwEng - Tooling
+
+## Introduction
+
+This article covers the support stack of software and hardware used by the hardware engineering
+team to develop the orbiter.
+
+Topics covered by this documentation:
+
+* Computer Systems
+  * Dev/qa/prod systems
+
+* (Custom) Hardware machines/tools for prototypes
+  * Envelope Sealer
+  * Inflator
+  * Pressure chamber
+  * Reflow Oven
+  * RF Testing chamber
+  * Environmental Testing - Temperature
+  * Environmental Testing - UV
+
+* Software
+
+See the following links for the software setup guides
+
+	- <https://git.turnsys.com/TSGTechops/docs-techops/src/branch/master/TSYS-DevEnv-VsCode.md>
+	- <https://git.turnsys.com/mrcharles/dotfiles/src/branch/master/README.md>
+
+
+## Computer Systems
+
+* Raspberry Pi
+  * subobench (all lab equipment with a digital interface is attached to this). Documented on discourse.
+
+* x86 servers
+  * subodev We develop workloads here. Once a day update or so. (After any needed iterations on our dev workstations)
+  * suboqa We run qa/unit/integration/burn in etc tests here on all workloads. Expect once a week updates or so.
+  * suboprod We run production workloads here. All things on here should be expected to come under regulatory review. May be considered a system of record, need to ponder. This is CUDA enabled (quadro). Expected to be under cluster control (slurm).
+
+* Tegra cluster
+  * suboprod01-05
+
+## (custom) tooling for prototypes
+
+### Envelope Heat Sealer
+
+* Overview
+
+This is used for assembling the envelopes. It's a customized heat sealer, controlled by an Arduino for precision temperature control.
+
+* Bill of Materials
+
+### Inflator
+
+* Overview
+
+This is used for inflating the envelopes once they've been assembled (in particular for leak detection).
+
+It's a customized pump , controlled by an Arduino for precision pressure control.
+
+* Bill of Materials
+
+### Pressure chamber
+
+* Overview
+
+* Bill of Materials
+
+### Reflow Oven
+
+* Overview
+
+This is used 
+
+* Bill of Materials
+
+### Cameo Silhouette 
+
+* Overview
+
+This is used to (primarily) make solder stencils for PCB re-work we will be doing on prototypes.
+
+### RF Testing Chamber
+
+We will do as much EMC testing in house as we can. This will save us 10s of thousands of dollars
+and will increase our first pass chances at the FCC certified lab immensely. We can also rent out the chamber when we aren't using it.
+
+* Major components
+* Considerations/concerns
+* Budget/BoM
+
+### Environmental Testing
+
+We will do as much environmental testing in house as we can. Need to research if any external testing is required by regulation, but currently (03/03/2021) I'm un-aware of any that is required.
+Of course we will test extensively , for robustness etc.
+
+* Major components
+* Considerations/concerns
+* Budget/BoM
+
+#### UV
+
+#### Extreme cold
+