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8b7abea2f6
This adds the necessary patches for 4.19 kernel. Upstreamed patches were dropped, backported upstreamed patches from 4.20. Drop Winbond ID patch since that NAND IC was upstreamed to use SPI-NAND framework and support for it was backported from 4.20. Rework ESSEDMA patches to compile under 4.19 due to timer changes, Clément Péron did the hard work and his changes were taken from the initial 4.19 PR. MR33 changes had to be manually refreshed to apply. Refresh other patches to apply. Signed-off-by: Robert Marko <robimarko@gmail.com> Remove
32 lines
1.0 KiB
Diff
32 lines
1.0 KiB
Diff
From 342fc01bfd6d717602c71d96d3ef40a36e45e060 Mon Sep 17 00:00:00 2001
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From: Robert Marko <robimarko@gmail.com>
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Date: Fri, 5 Oct 2018 09:02:50 +0200
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Subject: [PATCH] mtd: spinand: winbond: Add support for W25N01GV
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W25N01GV is a single die version of the already supported
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W25M02GV with half the capacity. Everything else is the
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same so introduce support for W25N01GV.
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Signed-off-by: Robert Marko <robimarko@gmail.com>
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---
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drivers/mtd/nand/spi/winbond.c | 8 ++++++++
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1 file changed, 8 insertions(+)
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--- a/drivers/mtd/nand/spi/winbond.c
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+++ b/drivers/mtd/nand/spi/winbond.c
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@@ -84,6 +84,14 @@ static const struct spinand_info winbond
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0,
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SPINAND_ECCINFO(&w25m02gv_ooblayout, NULL),
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SPINAND_SELECT_TARGET(w25m02gv_select_target)),
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+ SPINAND_INFO("W25N01GV", 0xAA,
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+ NAND_MEMORG(1, 2048, 64, 64, 1024, 1, 1, 1),
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+ NAND_ECCREQ(1, 512),
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+ SPINAND_INFO_OP_VARIANTS(&read_cache_variants,
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+ &write_cache_variants,
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+ &update_cache_variants),
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+ 0,
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+ SPINAND_ECCINFO(&w25m02gv_ooblayout, NULL)),
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};
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/**
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