Tomasz Maciej Nowak 1c79f93819 ib: split out processing user provided packages ... Some device recipes remove default target packages. If user tries to add them back they will be ignored, since packages list is processed in one go. Process the device recipe packages first and do user ones later, so additions won't get filtered out. Signed-off-by: Tomasz Maciej Nowak <tmn505@gmail.com> (cherry picked from commit e40b9a7fa0)		2023-07-19 21:57:25 +02:00
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imagebuilder	ib: split out processing user provided packages	2023-07-19 21:57:25 +02:00
linux	bcm53xx: backport DT changes queued for v6.6	2023-07-14 14:42:59 +02:00
llvm-bpf	llvm-bpf: fix rebuild check for generating tarball	2021-11-26 11:37:19 +01:00
sdk	sdk: rename README + update Makefile	2023-07-19 21:55:42 +02:00
toolchain	toolchain: switch packaged toolchain to tar.xz	2021-10-21 08:25:38 -10:00
Config.in	base-files: add eMMC sysupgrade support	2021-12-02 20:42:58 +00:00
Makefile	tools/llvm-bpf: move tarball packing to target/llvm-bpf	2021-11-22 12:00:40 +01:00