This option was a spi nor hack which is dropped in commit
bcf4a5f474 ("ramips: remove chunked-io patch and set spi->max_transfer_size instead")
Signed-off-by: Chuanhong Guo <gch981213@gmail.com>
Signed-off-by: Christian Lamparter <chunkeey@gmail.com> [edit message]
Specify firmware partition format by compatible string.
formats in ramips:
- denx,uimage
- tplink,firmware
- seama
It's unlikely but the firmware splitting might not work any longer for
the following boards, due to a custom header:
- EX2700: two uImage headers
- BR-6478AC-V2: edimax-header
- 3G-6200N: edimax-header
- 3G-6200NL: edimax-header
- BR-6475ND: edimax-header
- TEW-638APB-V2: umedia-header
- RT-N56U: mkrtn56uimg
But it rather looks like the uImage splitter is fine with the extra
header.
The following dts are not touched, due to lack of a compatible string in
the matching firmware splitter submodule:
- CONFIG_MTD_SPLIT_JIMAGE_FW
DWR-116-A1.dts
DWR-118-A2.dts
DWR-512-B.dts
DWR-921-C1.dts
LR-25G001.dts
- CONFIG_MTD_SPLIT_TRX_FW
WCR-1166DS.dts
WSR-1166.dts
- CONFIG_MTD_SPLIT_MINOR_FW
RBM11G.dts
RBM33G.dts
- CONFIG_MTD_SPLIT_LZMA_FW
AR670W.dts
- CONFIG_MTD_SPLIT_WRGG_FW
DAP-1522-A1.dts
Signed-off-by: INAGAKI Hiroshi <musashino.open@gmail.com>
Use diag.sh version used for other targets supporting different leds
for the different boot states.
The existing led sequences should be the same as before.
Signed-off-by: Mathias Kresin <dev@kresin.me>
Starting with kernel 4.4, the use of partitions as direct subnodes of the
mtd device is discouraged and only supported for backward compatiblity
reasons.
Signed-off-by: Alex Maclean <monkeh@monkeh.net>
Use the GPIO dt-bindings macros and add compatible strings in the
ramips device tree source files.
Signed-off-by: L. D. Pinney <ldpinney@gmail.com>
Signed-off-by: Mathias Kresin <dev@kresin.me>
Fix a typo in mt7621.dtsi compatible string. Disable spi, sdhci and pci
in mt7621.dtsi and enable the nodes in the indiviual board dts files.
The nodes require further device specific configuration anyway.
Remove the m25p80@0 spi child node from mt7621.dtsi and add the
chunked-io parameter to the individual board dts files. Fix the spi
flash compatible string for the WNDR3700V5.
Drop the mt7621-eval-board compatible string for all boards which are
not the eval board.
Drop the linux,modalias parameter from spi flash node.
Remove the xhci node from board files, it is already enabled in dtsi.
Disable xhci for boards not having usb ports populated.
Signed-off-by: Mathias Kresin <dev@kresin.me>
All compiled device tree files not mentioned are binary identical to the
former ones.
Fix the obvious decimal/hex confusion for the power key of ramips/M2M.dts.
Due to the include of the input binding header, the BTN_* node names in:
- ramips/GL-MT300A.dts
- ramips/GL-MT300N.dts
- ramips/GL-MT750.dts
- ramips/Timecloud.dts
will be changed by the compiler to the numerical equivalent.
Move the binding include of lantiq boards to the file where they are
used the first time to hint the user where the values do come from.
Signed-off-by: Mathias Kresin <dev@kresin.me>
