Upstream commit:
80483c3abf8 ("ARM: qcom: Cleanup/Remove unnecessary board file")
removed all the platform device compatibles stating that:
"This patch removes the unnecessary board file. The generic machine
definition is sufficient for the Qualcomm platforms."
Signed-off-by: Christian Lamparter <chunkeey@gmail.com>
This adds the necessary patches for 4.19 kernel.
Upstreamed patches were dropped, backported upstreamed patches
from 4.20.
Drop Winbond ID patch since that NAND IC was upstreamed to use
SPI-NAND framework and support for it was backported from 4.20.
Rework ESSEDMA patches to compile under 4.19 due to timer changes,
Clément Péron did the hard work and his changes were taken from the
initial 4.19 PR.
MR33 changes had to be manually refreshed to apply.
Refresh other patches to apply.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Remove
