Commit Graph

7 Commits

Author SHA1 Message Date
Moritz Warning
661e37ccea layerscape: split up DEVICE_TITLE definitions
DEVICE_TITLE is split up into DEVICE_VENDOR, DEVICE_MODEL and DEVICE_VARIANT

Signed-off-by: Moritz Warning <moritzwarning@web.de>
2019-09-25 12:50:24 +02:00
Biwen Li
c07d3302b3 layerscape: convert to use TF-A for firmware
This patch is to convert to use TF-A for firmware.
- Use un-swapped rcw since swapping will be done in TF-A.
- Use u-boot with TF-A defconfig.
- Rework memory map for TF-A introduction.

Signed-off-by: Biwen Li <biwen.li@nxp.com>
Signed-off-by: Yangbo Lu <yangbo.lu@nxp.com>
2019-06-06 15:40:09 +02:00
Mathew McBride
17468cc090 layerscape: rename Traverse boards along SoC lines
Upcoming product specification and branding changes mean that the names in tree do not accurately reflect released products.
To reduce any confusion, sort our boards by SoC family, e.g traverse-ls1043. Any future boards using Layerscape family SoC's
will be treated the same way, e.g Device/traverse-ls/lx/laXXXX.
The affected boards so far have only been available through OEM channels and those aren't using the provided sysupgrade.

Signed-off-by: Mathew McBride <matt@traverse.com.au>
2019-03-10 17:48:23 +01:00
Yangbo Lu
583af20b8b layerscape: use MKUBIFS_OPTS for per-device ubi parameters
UBIFS_OPTS couldn't be used for per-device ubi parameters.
Let's use MKUBIFS_OPTS instead.

Signed-off-by: Yangbo Lu <yangbo.lu@nxp.com>
2018-12-18 20:17:23 +01:00
Yangbo Lu
7016dd48f1 layerscape: add ls1012afrwy support and drop ls1012afrdm
ls1012afrdm was no longer supported in NXP Layerscape SDK.
Instead a new board ls1012afrwy was introduced in LSDK.
This patch is to drop ls1012afrdm and add ls1012afrwy support.
Since only 2MB NOR flash could be used, we just put u-boot
and firmware on NOR flash, and put kernel/dtb/rootfs on SD
card.

The Layerscape FRWY-LS1012A board is an ultra-low-cost
development platform for LS1012A Series Communication
Processors built on Arm Cortex-A53. This tool refines the
FRDM-LS1012A with more features for a better hands-on experience
for IoT, edge computing, and various advanced embedded
applications. Features include easy access to processor I/O,
low-power operation, micro SD card storage, an M2 connector, a
small form factor, and expansion board options via mikroBUS Click
Module. The MicroBUS Module provides easy expansion via hundreds
of powerful modules supporting sensors, actuators, memories,
and displays.

Signed-off-by: Yangbo Lu <yangbo.lu@nxp.com>
2018-09-22 21:20:57 +02:00
Yangbo Lu
eb684205e5 layerscape: add SD card boot support
NOR/QSPI Flash on Layerscape board only has limited 64MB memory size.
Since some boards (ls1043ardb/ls1046ardb/ls1088ardb/ls1021atwr)
could support SD card boot, we added SD boot support for them to put
all things on SD card to meet large memory requirement.

Signed-off-by: Yangbo Lu <yangbo.lu@nxp.com>
2018-09-22 21:20:57 +02:00
Yangbo Lu
0d95eb2cce layerscape: split image makefile per subtarget
This patch is to split image makefile per subtarget.
The ARMv7 subtarget will be added in the future.
It will be not convinient if only one makefile is used
for several subtargets management and future development.
This patch also dropped 32-bit Traverse LS1043-S since
Traverse only intended to support 64-bit and the 32-bit
compile now had an issue.

Signed-off-by: Yangbo Lu <yangbo.lu@nxp.com>
2018-09-22 21:20:57 +02:00